Micron Launches World’s First 176-Layer NAND in Mobile Solutions

Micron Technology, Inc., (Nasdaq: MU) announced today it has begun volume shipments of the world’s first 176-layer NAND Universal Flash Storage (UFS) 3.1 mobile solution. Engineered for high-end and flagship phones, Micron’s discrete UFS 3.1 mobile NAND unlocks 5G’s potential with up to 75% faster sequential write and random read performance than prior generations, enabling downloads of two-hour 4K movies in as little as 9.6 seconds. Micron’s 176-layer NAND offers a compact design ideal for the high capacity, small form factors required in mobile devices. This launch follows quickly on the heels of Micron’s volume delivery of PCIe Gen4 solid-state drives with 176-layer NAND in June, bringing high performance, design flexibility and low power consumption to professional workstations and ultrathin notebooks. Now available for smartphones, Micron’s industry-pioneering advanced NAND technology and performance enables a more responsive mobile experience with true multitasking across apps.