New material will contribute to heat dissipation when used in next-generation heat sinks for power devices; process proposals and supply of prototypes tailored to customer needs also possible Tokyo, July 20, 2021 – (JCN Newswire) – TANAKA Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka) announced today that TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), which operates the TANAKA Precious Metals manufacturing business, developed an active brazing filler metal/copper composite material for power devices that can reduce processing times. The new product is a composite (cladding) of copper (Cu) material with active brazing filler metal on one side. Since it can be joined directly to any material including ceramics (oxides, nitrides, and carbides) and carbon materials, it is expected that it will be used in ceramic substrates and next-generation heat sinks for power devices. In addition, TANAKA can make various proposals tailored to customer needs ranging from supply of prototypes using this product to brazing processes, testing, and evaluation.
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