Metal diffusion bonding is an essential joining method for achieving a high-purity interface when two similar metals require superior structural integrity. The process involves applying high temperature, and pressure to metals mated together in a hot press causes the atoms on solid metallic surfaces to intersperse and bond. There are probably no other commercially viable materials joining process that can produce such consistent results today. The applied pressure induced by a hot-press tool, combined with software and loop-back sensors for precise control to within micrometer accuracy, can produce constant pressure over several square feet of area for a component assembly. As a result, this technology has attracted the interest of design engineers in the semiconductor, aerospace, and energy industries.
TALLAHASSEE, FL – Advanced Manufacturing International (AMI) has been awarded a $2M grant