CyberOptics Corporation (NASDAQ: CYBE), a global developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan Dec 1-3rd. The company will also exhibit in WaferSense and ReticleSense sensors and feature the WX3000 Metrology and Inspection system in booths I3128, L0310, J2434 and K2106 at TaiNEX 1, Taipei, Dec 28-30th. Dr. Charlie Zhu, Director of Engineering at CyberOptics, will present ‘3D Inspection Is Becoming Essential in Advanced Packaging’ in the AP technical track on December 2nd at 3:30pm local time.
AMI Awarded $2M Grant from Florida Department of Commerce to Deploy Smart Manufacturing Lab
TALLAHASSEE, FL – Advanced Manufacturing International (AMI) has been awarded a $2M grant
