ACM Research’s 18 Chamber, 300mm Ultra C VI Single-Wafer Cleaning Tool Enters Mass Production

ACM Research, Inc. (ACM) (NASDAQ: ACMR), a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that its 18 chamber, 300mm Ultra C VI single wafer cleaning tool has been qualified by a customer and successfully moved to mass production. First introduced to the market in the second quarter of 2020, the tool has also been qualified for mass production by a mainstream memory chip manufacturer in China. “As technology nodes shrink, the complexity of chips is increasing, as are the number of wet cleaning process steps,” said Dr. David Wang, ACM’s President and Chief Executive Officer. “With the current unprecedented demand for semiconductor chips, the requirements for production capacity have become higher as well—and our 18 chamber system directly addresses this need. By moving our Ultra C VI tool to mass production, we can better serve our customers, allowing them to increase throughput by 50% versus the Ultra C V 12-chamber system, yet with a similar footprint.”