Nepes Laweh Corporation (Nepes: KOSDAQ 033640) announced the successful production of the world’s first 600mm x 600mm large Panel Level Packaging (PLP) using Deca’s M-Series fan-out technologies. Nepes Laweh had a grand opening of the Cheongan Campus PLP Line on December 7th with the presence of the Minister of Trade, Industry and Energy, the Governor of Chungcheongbuk-do, and representatives of clients and partners. The company announced that the Fan-out-Panel Level Packaging (FOPLP) line completed customer certification in the third quarter, and secured a stable yield and entered full-scale mass production. The recently opened Cheongan Campus is built on a 46-acre (186,000m2) of land which is equivalent to 25 soccer fields. The campus is a PLP fab facility that can produce up to 96,000 of 600mm panels with PLP per year. Nepes is expected to provide high-density packaging solutions required for advanced system semiconductors for each application, such as smartphones, automobiles, and IoT, based on the customer needs.
TALLAHASSEE, FL – Advanced Manufacturing International (AMI) has been awarded a $2M grant